ECPE Ua Haujlwm Pab Pawg AQG 324 tau tsim nyob rau lub Rau Hli 2017 tab tom ua haujlwm ntawm European Cov Lus Qhia Kev Tsim Nyog rau Cov Hluav Taws Xob Hluav Taws Xob rau Kev Siv Hluav Taws Xob Hluav Taws Xob Hloov Hluav Taws Xob hauv Cov Tsheb Tsav Tsheb.
Raws li yav dhau los German LV 324 ('Kev Tsim Nyog ntawm Lub Zog Hluav Taws Xob Hluav Taws Xob rau Kev Siv Hluav Taws Xob Hluav Taws Xob - Cov Kev Xav Tau, Kev Xeem thiab Kev Xeem') ECPE Cov Lus Qhia txhais cov txheej txheem ib txwm rau kev ntsuas qhov ntsuas ntsuas nrog rau kev ntsuas ib puag ncig thiab lub neej ntawm fais fab hluav taws xob modules rau automotive daim ntawv thov.
Cov lus qhia tau raug tso tawm los ntawm Pawg Saib Xyuas Kev Ua Haujlwm muaj lub luag haujlwm suav nrog ECPE cov tswv cuab cov tuam txhab nrog ntau dua 30 tus neeg sawv cev kev lag luam los ntawm cov khoom siv tsheb.
Tam sim no AQG 324 version hnub tim 12 Lub Plaub Hlis 2018 tsom rau Si-raws li lub zog modules uas yav tom ntej versions yuav raug tso tawm los ntawm Pawg Ua Haujlwm kuj tseem yuav npog cov tshiab dav bandgap fais fab semiconductors SiC thiab GaN.
Los ntawm kev txhais lus tob tob AQG324 thiab cov qauv muaj feem cuam tshuam los ntawm pab pawg kws tshaj lij, GRGT tau tsim cov peev txheej ntawm kev kuaj xyuas fais fab, muab cov ntaub ntawv pov thawj AQG324 tshuaj xyuas thiab pov thawj rau cov lag luam nce thiab nqis hauv kev lag luam hluav taws xob semiconductor.
Lub zog ntaus ntawv modules thiab sib npaug tshwj xeeb tsim khoom raws li cov khoom siv tsis sib xws
● DINENISO / IEC17025: Cov Lus Qhia dav dav rau Kev Ntsuas Kev Ntsuas thiab Kev Ntsuas Ntsuas
● IEC 60747: Semiconductor Devices, Discrete Devices
● IEC 60749: Semiconductor Devices - Mechanical thiab Climatic Test Methods
DIN EN 60664 Kev sib koom ua ke ntawm rwb thaiv tsev rau cov khoom siv hauv cov tshuab hluav taws xob tsawg
● DINEN60069: Environmental Testing
● JESD22-A119: 2009: Tsawg Kub Cia Lub Neej
Test hom | Cov khoom kuaj |
Module nrhiav tau | Static tsis, dynamic tsis, kev sib txuas txheej nrhiav kom tau (SAM), IPI / VI, OMA |
Module yam ntxwv xeem | Parasitic stray inductance, thermal tsis kam, luv Circuit Court tiv taus, rwb thaiv tsev kuaj, mechanical parameter detection |
Kev kuaj ib puag ncig | Thermal shock, mechanical vibration, mechanical shock |
Kev sim neej | Lub zog cycling (PCsec, PCmin), HTRB, HV-H3TRB, dynamic rooj vag bias, dynamic rov qab bias, dynamic H3TRB, lub cev diode bipolar degradation |